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Semiconductor Testing and Characterization
COURSE

Semiconductor Testing and Characterization

INR 59
0.0 Rating
📂 Nasscom FutureSkills Prime

Description

This subject covers comprehensive testing methodologies and characterization techniques for semiconductor devices and circuits. Students learn about electrical testing, failure analysis, reliability assessment, and quality control methods used throughout the semiconductor development and manufacturing process.

Learning Objectives

Students will master various electrical and physical characterization techniques, develop expertise in automated test equipment and measurement systems, implement effective failure analysis and debug methodologies, understand reliability testing and qualification procedures, design test structures and monitoring circuits, and demonstrate proficiency with industry-standard test and measurement tools.

Topics (13)

1
High-Frequency and RF Testing

Study of S-parameter measurements, network analyzers, on-wafer RF testing, and millimeter-wave characterization.

2
Electrical Parameter Testing

Study of I-V measurements, C-V analysis, parameter extraction techniques, and basic device characterization methods.

3
Automated Test Equipment (ATE)

Comprehensive study of ATE architecture, test program development, pattern generation, and production test optimization.

4
Wafer-Level Testing

Study of probe card design, wafer probing techniques, parametric testing, and wafer-level reliability screening.

5
Package-Level and Final Testing

Study of package test considerations, thermal testing, high-speed testing, and quality assurance procedures.

6
Failure Analysis Techniques

Study of physical failure analysis, electrical fault isolation, microscopy techniques, and chemical analysis methods.

7
Reliability Testing and Qualification

Study of temperature cycling, humidity testing, electrostatic discharge testing, and reliability prediction models.

8
Statistical Process Control and Yield Analysis

Study of control charts, capability analysis, defect density modeling, and yield improvement strategies.

9
Test Structure Design and Process Monitoring

Study of process control monitors, test structure layout, electrical rule checking, and process variation analysis.

10
Power Device Testing

Study of high-current testing, thermal resistance measurement, safe operating area testing, and power cycling.

11
Mixed-Signal and Analog Testing

Study of ADC/DAC testing, analog parameter measurement, noise characterization, and linearity testing.

12
Built-In Self-Test (BIST)

Study of memory BIST, logic BIST, analog BIST, and design for testability principles.

13
Advanced Characterization Techniques

Study of quantum device characterization, single-photon detection, cryogenic testing, and novel measurement techniques.